- DEPOSIT OF FILMS AND NANOMATERIALS
- Nanolithography and SEM Microscopy: Sigma Zeiss Raith Elphy plus, Resolución < 2nm
- Deep UV Lithography: MJB4 –Karl Suss mask aligner, Resol 500 nm
- Spin Coating: LabSpin6 Karl Suss, Max speed: 6000 rpm
- E-Beam Metal thin-film Evaporator:
- materials: Au, Ti, Al, etc
- High Vacuum: 10^{‐10} mbar
- Low Deposition rate <0,1 nm/nm/s
- Resolution: 1 nm
- Rapid Thermal Process (RTP)
- AS-ONE, Up to 1500 0C, Max ramp 200 ºC/s, High vacuum, air, O2,N2, He, Ar…
- Optical Microscope
- Leica DM8000
- Objectives: 5x,10x,20x,50x,100x
- Resolution 1 micron
- Stylus Profiler:
- Dektak XT Brucker
- Line profile and 3D topographical maps, Resolution < 1nm
- O2 Plasma Cleaner
- Harrick Plasma
- Graphene and carbon nanomaterials
- Etching and wafer cleanning
- Critical point Dryer
- Leica EM CPD030
- Chemical cabinet
- Wet etching process with different acids: HF, HCl, H2SO4,BOE etc.
- Equipped with: Milli-‐Q for ultrapure water (Type 1, ISO 3696)
- Hot plate with magnetic stirrer Microbalance and Ultrasonic bath
- Reactive Ion Etching/Induced Coupled Plasma (RIE/ICP)
- PlasmaPro System 100/1 Cobra 300 Oxford Instruments
- Dry etching of many materials (semiconductors, metals, dielectrics)
- Gas lines (Cl2, BCl3, Ar, He, N2, SF6, C4F8, O2, CH4, H2)
- Cyro-etching Aspect ratio > 100 at 10 nm scale.
- Micro Diamond Scriber MR-100
- Semi Automatic Wire Bonder
- TPT HB10: Top wire bonding of micro a nano electronic devices.
- Langmuir-Blodgett (KSV2000 System 2)
- To Fabricate and characterize monomolecular films with precise control of lateral packing density
- Brewster Angle Microscopy (Optrel BAM 3000)
- Visualization of Langmuir monolayers or adsorbate films at the air-water interface
- Kelvin probe (KSV SPOT1)
- It allows determining Composition, Dissociation degree, Orientation and Interaction in Langmuir monolayers
- Quartz CrystalMicrobalance (Q-sense E1)
- Mass changes and interactions occurring at surfaces.
- Surface rheology of surface bound materials.
